The application of plasma surface treatment in the LED industry
LED lights have the characteristics of high luminous efficiency, low power consumption, health and environmental protection (the light does not contain ultraviolet and infrared rays and does not produce radiation), protects eyesight, and have a long service life. It is known as the new light source of the 21st century. There are pollutants and oxide layers in the packaging process of LEDs, which cause the bonding colloid of the lampshade and the lamp holder to be not firm and tight, and there are tiny gaps.
There are two main reasons for the weak bonding of LED lamps. First, in the production process, the surface is inevitably contaminated with a large number of pollutants (such as (organic) matter, oxides, epoxy resin, tiny particles), which affects the bonding (effect). Second, the manufacturing materials of LED lamps are mainly PP, PE, and other difficult-to-stick plastics. This plastic has low surface energy, poor wetting ability, high crystallinity, non-polar molecular chain, and weak boundary. When the glue is bonded, it is easy to have a situation where the bonding is not strong, and the glue is opened.
The plasma surface treatment machine perfectly (beautifully) solves these two problems in plasma cleaning of LED lamps. When the machine acts on the surface of the material, the generated positive and negative plasma can chemically and physically clean the surface of the LED material. It realizes the removal of pollutants at the molecular level and removes surface pollutants such as organics, oxides, epoxy resins, and tiny particles. When the plasma generated by the plasma surface treatment machine treats PP, PE, and other plastics, the parts that need to be bonded are pretreated through surface activation, surface etching, surface grafting, surface polymerization, etc., and non-polar materials (active ), thus ensuring reliable bonding and long-term sealing of the glue.
The role of plasma surface treatment in the LED industry
1. Remove contaminants on the substrate, which is conducive to silver glue tiling and chip pasting;
2. Improve the adhesion between leads, chips, and substrates, and improve the bonding strength;
3. Clean the oxide layer or dirt so that the chip and the substrate are better and tightly combined with the colloid;
4. Improve the tightness of the combination of the colloid and the stent to prevent air infiltration from causing defects.