The rise in demand by semiconductor industry for high density and bandwidth, and low power solution, many IC designers are looking up for 3D ICs mounted with through silicon vias (TSVs). 3D ICs accommodate with multiple heterogeneous die such as logic, memory, analog, RF, and micro-electrical mechanical systems thereby improve performance and reduce cost. 3D ICs offers following advantages over traditional system on chips (SoC): low cost, easier to meet high interconnect speeds & bandwidth requirements, ideal for compact mobile devices, reduced resistance-inductance-capacitance helps in reducing power, emerging technologies such as MEMS can potentially be integrated into 3D stacks. 3D ICs with TSVs is showing huge opportunity for semiconductor industry. It offers compelling power, performance and form factor advantages and also can curb the escalating cost of SoC development. However, a well-defined ecosystem including foundries, IP providers, and vendors, need to emerge with more innovative design kits and reference flows
Although 3D ICs with TSVs do not require to adopt new 3D design system, but they are having some technical challenges such as development of cost-effective 3D processes and evaluation of various 3D platforms for a given application or a system. Because of the complex structure, fitting 3D ICs on a board is challenge for developers thereby requires a capable PCB layout system with appropriate analysis tools.
The 3D IC Market is growing rapidly over 17% of CAGR and is expected to reach at USD 10,470 million by the end of forecast period 2022. Growing increasing demand for advanced electronic products and high demand for 3D packaging using TSVs are the major factors driving the 3D ICs market.
Taste the market data and market information presented through more than 30 market data tables and figures spread over 90 numbers of pages of the project report. Avail the in-depth table of content TOC & market synopsis on “The 3D IC Market Research Report -Forecast to 2022”.
Get Free Sample Report @ https://www.marketresearchfuture.com/sample_request/1763
Table of Content:
3 Global 3D ICs Market, By Technology
3.1 3D IC Technology Type Market
3.1.1 Market By Sub-Segment
22.214.171.124 3D Stacked ICs
126.96.36.199 Monolithic 3D ICs
3.2 3D IC Packaging & Integration Type
188.8.131.52 3D System In Package (3D Sip)
184.108.40.206 3D Wafer Level Package (3D WLP)
220.127.116.11 2.5D & 3D Interposer
18.104.22.168 3D Heterogeneous Integration
4 Global 3D IC Market, By Component
4.2 Market By Sub-Segment
4.2.1 Through Silicon Vias (TSVs)
4.2.2 Through Glass Vias (TGVs)
5 Global 3D IC Market, By Products
5.2 Market By Sub-Segment
5.2.1 CMOS Image Sensors
5.2.2 3D Memory
5.2.3 MEMS & Sensors
5.2.4 Light Emitting Diodes (LEDs)
6 Global 3D ICs Market, By Applications
6.2 Market By Sub-Segment
6.2.2 Consumer Electronics
6.2.4 Aerospace & Defence
7 Global 3D ICs Market, By Region
7.2 Market By Regions
7.2.1 North America
7.2.4 Middle East & Africa
8 Competitive Landscape
8 Competitive Landscape
8.2 Competitive Scenario
8.3 Market Share Analysis
8.4 Company Profiles
8.4.1 Xilinx Inc.
22.214.171.124 Company Overview
126.96.36.199 Product/Services Offering
188.8.131.52 SWOT Analysis
8.4.2 Tezzaron Semiconductor Corporation
184.108.40.206 Company Overview
220.127.116.11 Product/Services Offering
18.104.22.168 Business Strategy
22.214.171.124 SWOT Analysis
8.4.3 BeSang Inc.
126.96.36.199 Company Overview
188.8.131.52 Product/Services Offering
184.108.40.206 Business Strategy
220.127.116.11 SWOT Analysis
8.4.4 Monolithic 3D Inc.
18.104.22.168 Company Overview
22.214.171.124 Product/Services Offering
126.96.36.199 Business Strategy
188.8.131.52 SWOT Analysis
8.4.5 United Microelectronics Corporation
184.108.40.206 Company Overview
220.127.116.11 Product/Services Offering
18.104.22.168 Business Strategy
22.214.171.124 SWOT Analysis
8.4.6 3M Company
8.4.7 Intel Corporation
126.96.36.199 Company Overview
188.8.131.52 Product/Services Offering
8.4.8 IBM Corporation
184.108.40.206 Company Overview
Get Complete Report @ https://www.marketresearchfuture.com/reports/3d-ic-market-1763
Market Research Analysis:
Regional analysis for 3D IC Market is studied in different geographic regions as Americas, Europe, Asia-Pacific and Rest of world. Asia-Pacific is dominating the market due to large semiconductor market and high growth of consumer electronics market in the region. China and Japan are the leading economy in production of integrated circuit in the region followed by India and Singapore. Europe is projected to be the second highest revenue generation region in 3D ICs market. Whereas, North America is subjected to be the fastest growing region in 3D IC market due to growing technological advancement in aerospace & defense and automotive market.
3D IC Market Segmentation
The 3D IC Market has been segmented on the basis of technology, component, product and applications. By technology, the market is being classified into type (3D stacked ICs and monolithic 3D ICs) and packaging & integration. By component, the 3D IC Market is categorized into through silicon vias (TSVs), and through glass vias (TGVs). By product, the market is further categorized into CMOS image sensors (CIS), 3D memory, MEMS & sensors, and light emitting diodes. By applications, the market is sub-segmented into IT/telecommunication, consumer electronics, industrial, aerospace & defense, automotive, medical and others.
The prominent players in the 3D IC Market are- Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and, IBM Corporation.
Market Research Future (MRFR) is an esteemed company with a reputation of serving clients across domains of information technology (IT), healthcare, and chemicals. Our analysts undertake painstaking primary and secondary research to provide a seamless report with a 360 degree perspective. Data is compared against reputed organizations, trustworthy databases, and international surveys for producing impeccable reports backed with graphical and statistical information.
We at MRFR provide syndicated and customized reports to clients as per their liking. Our consulting services are aimed at eliminating business risks and driving the bottomline margins of our clients. The hands-on experience of analysts and capability of performing astute research through interviews, surveys, and polls are a statement of our prowess. We constantly monitor the market for any fluctuations and update our reports on a regular basis.
Market Research Future
Office No. 528, Amanora Chambers
Magarpatta Road, Hadapsar,
Pune - 411028
+1 646 845 9312